Thermal Analysis Services
hitech provides Thermal Analysis Services, which incorporate transient analysis, radiation analysis, heat transfer analysis, steady state analysis, thermo-mechanical analysis, creep analysis, and conduction analysis.
Our thermal analysis services include cooling for electronic enclosures, heat exchangers, electric motors, furnaces, and gas turbine engine components. We are experts in providing cost-effective solution for design and optimization of electronic cooling systems.
We use various thermal simulation methods for thermal testing of materials like Polymers, Plastics, Composites, Laminates, Adhesives, Coatings, Organic materials, Food, Rubber, Pharmaceuticals, Petroleum, Chemicals, Biological units, etc during casting/molding or heat-treatment, manufacturing, distillation and other synthesis/manufacturing processes. Our thermal analysis expertise can help you in hot spot detection, identification of thermal and heating related flaws and design errors and to determine the effect of loading under high/low and transient temperatures.
Our FEA experts have the requisite knowledge of determining the characteristics of different elements, which change as the temperature changes. We have proficient thermal experts solve analysis problems using sophisticated tools and thermal analysis software like ANSYS, LS-DYNA, Cosmos, ANSA, HyperMesh, Nastran, Pro/Mechanica, etc.
Thermal Analysis Service Offerings:
- Transient Analysis
- Radiation Analysis
- Heat Transfer Analysis
- Steady State Analysis
- Thermo-Mechanical Analysis
- Creep Analysis
- Conduction Analysis
Our thermal analysis specialists are armed with a lethal combination of deep knowledge of heat transfer and thermodynamics. This lethal combination has its own advantages as it can ensure accurateness and novelty in thermal management of most complex electronic projects.
With a focus on delivering superlative services, hitech, has earned immense good faith and trust of its clients.
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